Endolysin Inhibits Skin Colonization by Patient-Derived Staphylococcus Aureus and Malignant T-Cell Activation in Cutaneous T-Cell Lymphoma

Research output: Contribution to journalJournal articleResearchpeer-review

Documents

  • Fulltext

    Final published version, 1.96 MB, PDF document

  • Emil M.H. Pallesen
  • Bob de Rooij
  • Ziao Zeng
  • Sana Ahmad
  • Andreas Willerslev-Olsen
  • Christian Röhrig
  • Maria R. Kamstrup
  • Lise Lindahl
  • Thorbjørn Krejsgaard
  • Lars Iversen
  • Sergei B. Koralov
  • Johan Frieling
  • Mathias Schmelcher

Staphylococcus aureus is suspected to fuel disease activity in cutaneous T-cell lymphomas. In this study, we investigate the effect of a recombinant, antibacterial protein, endolysin (XZ.700), on S. aureus skin colonization and malignant T-cell activation. We show that endolysin strongly inhibits the proliferation of S. aureus isolated from cutaneous T-cell lymphoma skin and significantly decreases S. aureus bacterial cell counts in a dose-dependent manner. Likewise, ex vivo colonization of both healthy and lesional skin by S. aureus is profoundly inhibited by endolysin. Moreover, endolysin inhibits the patient-derived S. aureus induction of IFNγ and the IFNγ-inducible chemokine CXCL10 in healthy skin. Whereas patient-derived S. aureus stimulates activation and proliferation of malignant T cells in vitro through an indirect mechanism involving nonmalignant T cells, endolysin strongly inhibits the effects of S. aureus on activation (reduced CD25 and signal transducer and activator of transcription 5 phosphorylation) and proliferation (reduced Ki-67) of malignant T cells and cell lines in the presence of nonmalignant T cells. Taken together, we provide evidence that endolysin XZ.700 inhibits skin colonization, chemokine expression, and proliferation of pathogenic S. aureus and blocks their potential tumor-promoting effects on malignant T cells.

Original languageEnglish
JournalJournal of Investigative Dermatology
Volume143
Issue number9
Pages (from-to)1757-1769
Number of pages15
ISSN0022-202X
DOIs
Publication statusPublished - 2023

Bibliographical note

Publisher Copyright:
© 2023

ID: 346595948